The fillet completely wets all elements to the periphery of the connection and is concave. The solder joint surface is smooth, nonporous and undisturbed, with a finish varying from satin to bright. Populated plated through holes (PTH) should exhibit a vertical solder fill of 100%, with a fully formed fillet on the solder side, and evidence of 100% wetting on the component side lead, barrel and pad. Solder fillets are smooth and shiny with concave profiles. Component leads exhibit proper bend radii and stress relief. Component and board markings are clear and legible. While discretes are rapidly being displaced by the smaller-form surface mount technology (SMT) package, the discrete component is still widely in use, especially in extreme environmental applications where the SMT device will not perform reliability and/or is unavailable.Ĭomponents are installed per engineering documentation and are parallel to, and in contact with, the board surface. Find out more about TGAsia Forum by contacting Harry will contact you and review your comments to understand your interest and follow through with next steps.THROUGH-HOLE SOLDERING GENERAL REQUIREMENTS THROUGH-HOLE SOLDERINGĭiscrete components are the backbone of the electronics world, consisting of individually packaged, leaded devices, highly integrated circuits (IC), interconnects, terminators, switches, etc. IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. If you are located in Asia Pacific Market . IPC encourages and welcomes individuals from the global electronics industry to submit their ideas or to request to be added to a ballot group as part of the standards development process.

Once accepted a project is established and the great work of the industry committees starts. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry.

We are continually looking for ways to improve current standards but we are also looking for what might be that next standard the industry. Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, design, manufacture of boards and finished assemblies. Complete the form on the right and just click on the submit button, a tech staff person will be in touch if there are any questions. The purpose of this form is to provide the appropriate technical committee of IPC with input from the industry regarding recommendations for published standards or work in progress on new or revisions of standards being worked on. Individuals or companies are invited to submit a comment to IPC on standards improvement via the Standards Improvement form, found on the right. IPC Status of Standardization Contribute to IPC Standards by Submitting Your Comments

Ipc soldering standards pdf